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filingDate 2018-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_801f6d3e6d89850d6e57bb80b986b410
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publicationDate 2019-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101961123-B1
titleOfInvention Ceramic metalizing substrate and manufacturing method thereof
abstract The present invention relates to a ceramic metallizing substrate and a manufacturing method thereof. A method of manufacturing a ceramic metallized substrate includes the steps of: preparing a copper paste by mixing a copper powder and a metal oxide; applying a copper paste to an upper surface of the ceramic substrate; sintering the copper paste to form a ceramic substrate And forming a copper metallization layer on the upper surface of the substrate. According to the present invention, a copper metallization layer which is dense and has a high bonding strength and a small amount of impurities can be formed on a ceramic substrate.
priorityDate 2018-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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