http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101954078-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5526d23f839aabb2a2a7eeaea5702aa3 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B6-145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B6-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 2018-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e45efbda4edcb869d9dba4493253e50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_201707a190add5bb36e29a904a8138f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e84760ce9f62d19d463a1505498f2385 |
| publicationDate | 2019-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101954078-B1 |
| titleOfInvention | A manufacturing method of oral sensor using print circuit board of build-up multi layer |
| abstract | The multilayer printed circuit board according to the present invention includes a plurality of laminated boards having one or a plurality of through holes and one or a plurality of connecting pins inserted into the through holes and joining the plurality of laminated boards, It is possible to miniaturize the thickness of the substrate and to achieve a reduction in the size of the via hole, diversification of the bump size, and prevention of cracks due to insulation, dimensional stability, strength, have. Since the multilayer printed circuit board according to the present invention has the above-described characteristics and does not cause peeling or lifting of the laminate even when subjected to high-temperature thermal shock, it does not cause changes in mechanical strength and electrical characteristics, And can be widely used for an internal sensor module of a dental intraoral sensor or the like. |
| priorityDate | 2018-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.