| abstract |
The present invention relates to thermosetting adhesives suitable for use as electrically conductive materials in the manufacture of electronic devices, integrated circuits, semiconductor devices, passive devices, solar cells, solar modules, and / or light emitting diodes. The thermosetting adhesive may comprise one or more thermosetting resins, electrically conductive particles having an average particle size of 1 to 50 mu m, and one or more metal precursors, wherein the metal precursor is substantially degraded to the corresponding metal during thermal curing of the thermosetting adhesive ). |