http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101945056-B1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
filingDate 2012-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2019-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101945056-B1
titleOfInvention Conductive paste and method for preparing conductive paste
abstract Provided is a conductive paste containing copper powder as a conductive material and capable of forming a conductive pattern with high precision by a screen printing method. A conductive paste comprising a copper particle (A), a resol-type phenol resin (B), and a thixotropic property-imparting agent (C) obtained by activating a fatty acid amide wax, wherein the content of the thixotropic property- Is the solid fatty acid amide wax, and is a conductive paste in a proportion of 0.05 to 2 mass% with respect to the entire conductive paste.
priorityDate 2011-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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