| abstract |
A method of electroplating metal on a substrate while controlling azimuthal uniformity, in one aspect, includes the steps of: (a) providing a substrate into an electroplating apparatus configured to rotate a substrate during electroplating; (b) Electroplating a metal on a substrate while rotating the substrate, wherein selected portions of the substrate at the selected azimuthal position are located at different azimuthal positions with the same size and the same radial position, And electroplating the metal, wherein the metal remains in the shielded area for a period of time that is different from the portion of the area. For example, a semiconductor wafer substrate may rotate slowly or rapidly during electroplating as a selected portion of the substrate passes through the shielded region. |