| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1702
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75745
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-7598
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75983
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75744 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4411
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0292 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-607 |
| filingDate |
2012-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101931358-B1 |
| titleOfInvention |
Jig and manufacturing method thereof and flip chip bonding method for chips composing ultrasound probe using jig |
| abstract |
wafer; A receiving groove formed by etching the wafer and accommodating a cMUT (capacitive micromachined ultrasonic transducer) at the time of flip chip bonding; And a spacing groove formed by etching a part of the bottom surface of the receiving groove, wherein the cMUT is inserted into the receiving groove such that the thin film of the cMUT faces the bottom surface of the spacing groove at the time of flip chip bonding, The thin film of the cMUT is separated from the bottom surface of the spacing groove by being seated on the bottom surface of the receiving groove, thereby preventing damage to the semiconductor chip having the double-sided design structure which may occur during flip chip bonding. |
| priorityDate |
2012-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |