| abstract |
(A) a siloxane diamine represented by the following formula (1), (B) a maleimide compound having at least two N-substituted maleimide groups in its molecular structure, and (C) an amine compound having an acidic substituent group A thermosetting resin composition using the modified silicone compound, a prepreg, a laminate, and a printed wiring board. The multilayer printed wiring board produced by using the laminated sheet obtained by laminating the prepreg obtained from the modified silicone compound or the thermosetting resin composition of the present invention has a glass transition temperature, a coefficient of thermal expansion, a copper foil adhesive property, a hygroscopic property, a moisture absorption solder heat resistance, Heat resistance, and is useful as a highly integrated semiconductor package or a printed wiring board for electronic equipment. |