| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0000e12114c67d9ea76f5628feb7250 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0075 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-641 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 |
| filingDate |
2017-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0315ccb7fb660eecb817ec30decb7482
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_812b964474261f9de5086eddc5027053 |
| publicationDate |
2019-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101918915-B1 |
| titleOfInvention |
Manufacturing method of high power LED radiator plate |
| abstract |
The present invention relates to a method for manufacturing a high-output LED radiator plate capable of enhancing adhesion between metal layers and plating a metal layer with a uniform thickness, and is characterized in that one surface of the LED radiator plate is made of molybdenum or tungsten, A second step of pretreating the other surface of the first substrate layer, and a second step of plating the other surface of the first substrate layer by plating one of copper plating, copper alloy plating and copper composite plating A fourth step of forming a second substrate layer, a fourth step of forming a third substrate layer by nickel plating on the second substrate layer, and a fifth step of forming a fourth substrate layer by gold plating on the third substrate layer . |
| priorityDate |
2017-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |