http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101917176-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_141c5c360293741c99739d24caf4235c |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0285 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-061 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2017-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b550f0a56199ffeebda18fbc46e2e7dd |
| publicationDate | 2018-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101917176-B1 |
| titleOfInvention | Manufacturing method of ir sensor printed circuit board for autonomous vehicle |
| abstract | The present invention overcomes the limitations of the human visual ability at nighttime and is used for autonomous driving to improve the reliability of the running system of the autonomous driving vehicle and to develop the identification ability to generate heat for all objects It is used for autonomous driving car which can improve precision for munitions by applying IR sensor and improve discrimination ability to realize safe driving safety of autonomous driving system and improve durability and reliability. And an object of the present invention is to provide a manufacturing method of an IR sensor printed circuit board for an autonomous vehicle. In order to achieve the above object, a method of manufacturing an IR sensor printed circuit board for an autonomous vehicle according to the present invention includes a first step (S100) of preparing an epoxy layer (100) in which a first copper foil (110) , A second step S200 of forming a predetermined inner layer circuit and a hole by performing an inner layer image process on the first copper foil 110 and a second step S200 of forming a predetermined circuit pattern on both surfaces of the epoxy layer 100 , A first prepreg layer (200) having a second copper foil (210) on one side and a second side laminated to the epoxy layer (100) and a predetermined circuit pattern on the other side, A third step (S300) of forming a third prepreg layer (300) having a third copper foil (310) on one side and the epoxy layer (100) and a second prepreg layer (300) A component hole B, a first mechanism hole C, and a second mechanism hole D are formed in the through holes A, B, (B), the first mechanism hole (C), the second mechanism hole (D), and the inner wall of the through hole (A) A fifth step (S500) of forming an electroless copper plating layer (400) on all areas including the first copper layer (210) and forming an electrolytic copper plating layer (500) on the electroless copper plating layer (400) A sixth step S600 of forming a predetermined outer layer circuit by performing an outer layer image process on the third copper foil 310, the electroless copper plating layer 400, and the copper electroplating layer 500 A hole of the through hole A, an inner wall and a hole of the component hole B, an inner wall and a hole of the first mechanism hole C, an inner wall of the second mechanism hole D, A seventh step S700 of printing an area excluding the outer layer circuit with the solder resist ink 600 and a step S700 of printing the marking ink 700 on the upper and lower surfaces of the solder resist ink 600 printed in the through hole A, (S800) for marking the solder resist ink (600), an area marked with the marking ink (700), and an area excluding the inner wall of the second mechanism hole (D) And a ninth step (S900) of forming a nickel plating layer 800 and a gold plating layer 900 sequentially. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102128009-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110483530-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102533264-B1 |
| priorityDate | 2017-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 85.