| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C19-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C19-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 |
| filingDate |
2015-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101916614-B1 |
| titleOfInvention |
Copper-nickel alloy electroplating device |
| abstract |
A copper-nickel alloy electroplating apparatus capable of stably forming a plating film of a uniform composition of copper and nickel in a plating object and capable of using the plating bath for a long period of time. The present invention relates to a copper-nickel alloy electroplating apparatus (1), which comprises a cathode chamber (4) in which an object to be cast (5) is arranged, an anode chamber (6) (8) for adjusting the oxidation-reduction potential of the plating solution in the cathode chamber, a plating solution supply unit (7) for supplying the plating solution in the anode chamber An anode room redox potential adjustment tank 10 for adjusting the redox potential of the anode and anode, and a power supply unit 36 for flowing a current between the cathode and anode. |
| priorityDate |
2014-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |