| abstract |
The light reflective anisotropic conductive adhesive used for anisotropic conductive connection of the light emitting element to the wiring board contains a thermosetting resin composition, conductive particles, light reflective acicular insulating particles and light reflective semiconducting insulating particles. The amount of the light-reflective acicular insulator particles and the light-reflective acicular insulator particles in the thermosetting resin composition is 1 to 50% by volume with respect to the thermosetting resin composition, and the compounding ratio of the light-reflective acicular insulator particles to the light- / V) is 1: 1 ~ 10. The light reflecting anisotropic conductive adhesive is titanium oxide whisker, zinc oxide whisker, titanate whisker, aluminum borate whisker, or wollastonite. |