| abstract |
A resist composition is prepared by applying a resist composition containing a base component (A) which generates a base by exposure and has increased solubility in an alkali developer by the action of an acid, onto the support (1) to form a resist film The resist film 2 is subjected to an alkali development to form a resist film 2 (step (1)), a step 2 of exposing the resist film 2, a step 3 of baking after the step (4) of forming a negative resist pattern by dissolving and removing the unexposed portion (2b) of the resist pattern (2), and the resist composition used in the step (1). |