| abstract |
One aspect of the present invention is a method of manufacturing a substrate. In one embodiment, the method includes providing a mixture comprising metal particles and an electroless deposition solution, electrolessly depositing a metal matrix, co-depositing the metal particles, And forming a conductor in the conductor. In another embodiment, the method includes providing a mixture comprising metal particles and an electrochemical plating solution, electrochemically plating the metal matrix, and cooperating with the metal particles to form a conductor on the substrate or within the substrate . Another aspect of the invention is a mixture for forming a conductor on or in a substrate. Another aspect of the invention is an electronic device. |