http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101905543-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
| filingDate | 2011-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101905543-B1 |
| titleOfInvention | The light emitting device package |
| abstract | The present invention relates to a light emitting device package, comprising: a body including a cavity; first and second lead frames separated from each other in the cavity; at least one light emitting element disposed in the cavity; A light emitting device package comprising a molding material, an interfacial adhesion layer formed between the body and the molding material, and an injection port extending from the exterior to the bottom surface of the cavity, the injection port being embedded with the same material as the interfacial adhesion layer do. Therefore, when the primer before resin lamination is applied, the primer is prevented from being discharged to the light emitting chip or the wire, thereby preventing discoloration of the chip and the wire. Therefore, light absorption due to discoloration of the chip and the wire is prevented, thereby ensuring the amount of emitted light and compensating chromaticity deviation. |
| priorityDate | 2011-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.