http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101900500-B1

Outgoing Links

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filingDate 2010-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101900500-B1
titleOfInvention Conductive substrate
abstract Provided is a conductive substrate having a metal fine particle sintered film of a pattern shape such as a copper wiring formed on a substrate such as polyimide and having high adhesion with a substrate and having excellent conductivity. A conductive substrate of the present invention is a conductive substrate formed by printing a coating liquid containing metal or metal oxide fine particles on a substrate to form a printing layer and firing the printing layer to form a sintered metal fine particle film, The crystallite diameter measured by X-ray diffraction in the sintered film is 25 nm or more, and the porosity of the section of the fine metal particle sintered film is 1% or less, and a production method thereof.
priorityDate 2009-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 37.