http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101900500-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 |
filingDate | 2010-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2018-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2018-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101900500-B1 |
titleOfInvention | Conductive substrate |
abstract | Provided is a conductive substrate having a metal fine particle sintered film of a pattern shape such as a copper wiring formed on a substrate such as polyimide and having high adhesion with a substrate and having excellent conductivity. A conductive substrate of the present invention is a conductive substrate formed by printing a coating liquid containing metal or metal oxide fine particles on a substrate to form a printing layer and firing the printing layer to form a sintered metal fine particle film, The crystallite diameter measured by X-ray diffraction in the sintered film is 25 nm or more, and the porosity of the section of the fine metal particle sintered film is 1% or less, and a production method thereof. |
priorityDate | 2009-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.