| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2012-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101899621-B1 |
| titleOfInvention |
Method for copper plating |
| abstract |
A copper plating method in a plating bath wherein a substrate is contacted with a heterocyclic core having a thiol group and a leveler additive comprising an amino group attached to the heterocyclic core by a spacer is disclosed. The method is particularly suitable for filling grooved structures in the manufacture of printed circuit boards, IC substrates and semiconductor substrates. |
| priorityDate |
2011-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |