| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0084
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate |
2012-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101896965-B1 |
| titleOfInvention |
Epoxy resin compound and radiant heat circuit board using the same |
| abstract |
The present invention relates to an epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler as a main component, wherein the epoxy resin comprises an epoxy resin of the formula: Therefore, the thermal conductivity can be increased by using an epoxy resin including a mesogen structure that enhances crystallinity. Further, by using the epoxy resin as an insulating material for a printed circuit board, a highly heat-radiating substrate can be provided. |
| priorityDate |
2012-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |