| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07811 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate |
2011-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101892753-B1 |
| titleOfInvention |
Method of manufacturing light emitting device |
| abstract |
When a light emitting device such as a light emitting diode (LED) element is flip-chip mounted on an interconnection plate using an anisotropic conductive adhesive, a light reflection layer that causes an increase in manufacturing cost is not formed in the LED element, So that cracks and defects do not occur in the light emitting device. To this end, a light-reflective anisotropic conductive adhesive containing a thermosetting resin composition, conductive particles and light-reflective insulating particles is disposed between a light-emitting element and a wiring board to which the light-emitting element is to be connected, (JIS K 6253) of 40 or more and less than 90 by an application of an anisotropic conductive connection. |
| priorityDate |
2010-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |