http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101866332-B1
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02T10-7072 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
filingDate | 2012-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2018-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2018-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101866332-B1 |
titleOfInvention | Photosensitive resin composition, cured product thereof, photosensitive solder resist ink, dry film type photosensitive solder resist, and method for producing photosensitive resin |
abstract | (PROBLEMS TO BE SOLVED BY THE INVENTION) A photosensitive resin composition excellent in flexibility, insulation, adhesiveness and the like and used suitably for a photo solder resist is provided. A composition comprising at least one compound selected from a photosensitive resin (A), an epoxy group-containing compound, an unblocked isocyanate compound, a blocked isocyanate compound and a? -Hydroxyalkylamide group-containing compound, and a photopolymerization initiator, (C) is obtained from an epoxy compound (a) having at least two epoxy groups in one molecule and a phenol compound (b) having at least two phenolic hydroxyl groups in one molecule, and the side chain hydroxyl group- (E) is obtained from the above-mentioned (c) and the polybasic acid anhydride (d), and the resin (e) obtained from the epoxy group or the oxetane group in the compound (f) having the epoxy group or oxetane group and the ethylenic unsaturated group Resin. |
priorityDate | 2011-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 737.