| abstract |
There is provided a curable epoxy resin composition which exhibits excellent fluidity at the time of molding without adversely affecting the physical properties of the cured product. The curable epoxy resin composition comprises (I) a curable epoxy resin, and (II) an epoxy functional group having an epoxy equivalent of 3,000 or less, an aromatic hydrocarbon group content of 45 to 80% by weight and a glass transition point of less than 0 캜, Containing organopolysiloxane. |