| abstract |
The present invention relates to a glass substrate for semiconductor, which has a non-through hole, a groove or a step on at least one surface thereof, and is provided between a side surface of a non-through hole, a groove or a step and a surface having a non- Wherein the first chamfer portion exists and the side and bottom surfaces of the non-through hole, groove or step are a mirror surface and the first chamfer portion is a mirror surface. According to the present invention, in a glass substrate for semiconductors having a non-penetrating hole, groove or step, such as a synthetic quartz glass substrate for a photomask substrate or a mold substrate for a nanoimprint used in a photolithography process, A synthetic quartz for semiconductor having a high precision in shape and a non-penetrating hole, groove or step whose bottom face and side face are mirror-finished and which is hard to be cracked or scratched in a non-through hole, groove or step, A glass substrate can be provided. |