http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101852907-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8112 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-64 |
| filingDate | 2010-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101852907-B1 |
| titleOfInvention | Method of bonding a semiconductor device using a compliant bonding structure |
| abstract | A compliant bonding structure is disposed between the semiconductor device and the mount (40). In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example, by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill the space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is a plurality of metal bumps 32 that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer 46. |
| priorityDate | 2009-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.