| abstract |
The silicone resin of the present invention is a silicone resin having a constitutional unit represented by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000, which is a silicone resin (A-1) having a silicon content of 10 to 40% And the silicone resin (A-2) having a silicon content of 50 to 80 mass%, and the mass content of the silicone resin (A-1) in the total mass of the silicone resin is 10 to 50 mass%. (wherein a and b are all positive numbers, a + b = 1 and X is a divalent linking group of the formula (2) or the formula (2) and the formula (3) D is the number of moles of the unit represented by the formula (3), and c: d is 0? D? 1 when c is 1). (Effect) The present invention can be processed into a film, has a good molding performance for a large diameter wafer and a thin wafer, is excellent in adhesion, low warpage, and wafer protection, And becomes a resin film suitably usable in a wafer level package. |