| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0793 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| filingDate |
2012-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101847676-B1 |
| titleOfInvention |
Process for etching a recessed structure filled with tin or a tin alloy |
| abstract |
The present invention discloses a method for planarization of recessed structures filled with tin or tin alloy that avoids the formation of dimples. These structures can serve as solder deposits for stable and reliable solder joints in electronic devices. |
| priorityDate |
2011-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |