| abstract |
Disclosed is a resin composition for sealing an electronic device capable of sealing without air trapping between the substrate and a vapor and suppressing permeation of water vapor, and an electronic device using the resin composition for sealing an electronic device. (A) a polybutadiene polymer having a (meth) acryloyl group at the end represented by the following formula (1) and (B) a photopolymerization initiator and does not include a thermoplastic resin having a mass average molecular weight of 50,000 or more (Wherein R 1 and R 2 each represent a hydroxyl group or H 2 C═C (R 7 ) -COO-, and R 3 and R 4 each independently represent a substituted or unsubstituted N group having 1 to 16 carbon atoms 1 and m are 0 or 1, n is an integer of from 15 to 150, and x: y = 0 to 1, and R < 5 > 100: 100 to 0, provided that R1 and R2 are not all hydroxyl groups.) |