http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101846303-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0408 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04 |
| filingDate | 2015-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101846303-B1 |
| titleOfInvention | Bi-directional conductive module, semiconductor test socket and manufacturing method thereof |
| abstract | The present invention relates to a bidirectional conductive module, a semiconductor test socket, and a method of manufacturing the same. A bidirectional conductive module according to the present invention includes: an insulating unit body made of an elastic material; an insulating sheet disposed in the insulating unit body, the insulating sheet having an upper bent portion with an upper region bent, and a lower bent region bent with a lower region; A plurality of first upper conductive pads spaced apart from each other on an upper surface of the upper bent portion, a plurality of second upper conductive pads formed on a lower surface of the upper bent portion at positions corresponding to the first upper conductive pads, A plurality of first lower conductive pads spaced apart from each other on the lower surface of the lower bent portion, and a plurality of second lower conductive pads formed on the upper surface of the lower bent portion at positions corresponding to the first lower conductive pads, And a conductive line electrically connecting the second upper conductive pad and the second lower conductive pad, which correspond to each other, A plurality of upper contact portions provided on respective upper portions of the first upper conductive pads and electrically connected to the first upper conductive pads and the second upper conductive pads and exposed from an upper surface of the insulating unit body; And a lower contact portion provided on a lower portion of each of the first lower conductive pads and electrically connected to the first lower conductive pads and the lower conductive pads and exposed to a lower surface of the insulating unit body; Each of the upper contact portions includes a plurality of upper projecting projections of a conductive material protruding upward from the upper surface of the first upper conductive pad and a plurality of upper projecting projections of the plurality of upper projecting projections, And an upper plating layer plated on the first upper conductive pad and the second upper conductive pad to electrically connect the first upper conductive pad and the second upper conductive pad so as to surround the first upper conductive pad and the second upper conductive pad. |
| priorityDate | 2015-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.