| abstract |
There is provided a method of manufacturing a copper clad laminate in which a copper foil and a resin are bonded with a high adhesive force while using a thermoplastic resin having a low dielectric constant. The method comprises the steps of preparing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals comprising copper oxide and copper oxide, And adhering a sheet-like thermoplastic resin to the cotton-treated surface to obtain a copper clad laminate. The surface to be roughened has a thickness of 1 to 20 nm which is determined by a continuous electrochemical reduction analysis (SERA) at the time of adhering the thermoplastic resin, and is determined by continuous electrochemical reduction analysis (SERA) And a copper thickness of 15 to 70 nm. |