| abstract |
It is possible to surely and easily hold the device wafer when the device wafer is mechanically or chemically treated and at the same time, even if the device wafer is subjected to a process at a high temperature, And a composition for forming a protective layer for forming the laminate, a composition for forming a release layer, and a kit. The laminate has a device wafer, a protective layer, a release layer, and a support substrate in this order, wherein the protective layer is in contact with only the device wafer and the release layer, the release layer is in contact with only the protective layer and the support substrate, Includes a fluorine atom and / or a silicon atom. |