| abstract |
The polyimide according to the present invention uses a siloxane-based diamine having a specific structure and a solvent having a partial coefficient of dispersion, to reduce the thermal expansion shrinkage characteristics of the resulting polyimide film and to provide a film having transparency, heat resistance, mechanical strength and flexibility And it is possible to effectively reduce the residual stress so that it can be used as a substrate for a device, a cover substrate for a display, an optical film, an IC package, an adhesive film, a multilayer flexible printed circuit (FPC) Protective films for optical discs, and the like. |