patent/KR-101840626-B1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101840626-B1

Outgoing Links

Predicate	Object
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R2201-003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49861 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4828 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-005
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R19-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R19-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R31-00
filingDate	2014-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2018-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2018-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-101840626-B1
titleOfInvention	Semiconductor package and manufacturing method thereof
abstract	A semiconductor package is disclosed. The semiconductor package includes a first side, a second side, a molded substrate, a die, and a lead frame. The second side of the semiconductor package is opposite the first side of the semiconductor package. The die and leadframe are embedded in a molded substrate. The leadframe is also positioned between the first side and the second side of the semiconductor package to provide a first electrical connection between the first side and the second side of the semiconductor package.
priorityDate	2013-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426099678 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6337007 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541

Total number of triples: 33.