| abstract |
A method of attaching a chip to a substrate having an outer layer comprising a via filler mounted in a dielectric such as a solder mask, the end of the via filler being at the same height as the dielectric, (o) optionally removing the organic varnish (P) disposing a chip having a solder bump and a leg terminating in contact with the exposed end of the via filler; and (q) disposing a solder bump on the solder bump to heat the solder bump Lt; / RTI > |