| abstract |
(Problems to be Solved) A BGA semiconductor package which is thin and has excellent external terminal connection property by embedding a micro ball for external connection in a bag can be supplied by using a simple board and a manufacturing method thereof do. The BGA semiconductor package includes a substrate on which a semiconductor element is mounted, an adhesive for bonding the semiconductor element and the substrate, a conductive microball held in a through hole formed in the substrate, a bonding wire for electrically connecting the semiconductor element and the microball, And a plug for sealing a semiconductor element side of the substrate with a sealing resin, wherein at least a part of the bottom surface of the micro ball is covered with a sealing resin And an exposed portion exposed through the through hole formed in the substrate from the bottom surface and exposed as an external connection terminal. |