| abstract |
The present invention provides an epoxy resin composition and prepregs and laminates using the same. The epoxy resin composition comprises (A) an imide-modified epoxy resin; (B) a crosslinking agent, wherein the imide-modified epoxy resin is an epoxy resin having a structure of Formula (1) or / and Formula (2). The prepreg and the laminate made of the epoxy resin composition have high glass transition temperature, low dielectric constant, low dielectric loss factor, high moisture resistance, high toughness and good processability. |