| abstract |
There is provided a curable resin composition which is excellent in various properties such as electrical insulation, adhesion, heat resistance, crack resistance and gold plating resistance and also excellent in electrical insulation and adhesion under a strict environment such as high temperature and high humidity, Providing film and printed wiring boards. (A) a curing resin composition comprising a carboxyl group-containing resin, (B) an inorganic filler, (C) a thermosetting component, and (D) a compound having a urethane bond, And a carboxyl group-containing resin, wherein the thermosetting component (C) comprises a maleimide compound. |