| abstract |
SUMMARY OF THE INVENTION It is an object of the present invention to provide a technique capable of reducing the chip size of a semiconductor chip. In particular, it is intended to provide a technology capable of reducing the chip size of a semiconductor chip by devising a layout arrangement in a short side direction in a rectangular semiconductor chip constituting an LCD driver. In the semiconductor chip CHP2 constituting the LCD driver, the input protection circuits 3a to 3c are disposed under a part of the input bump electrodes IBMP among the plurality of input bump electrodes IBMP, and among the plurality of input bump electrodes IBMP The input protection circuits 3a to 3c are not disposed under the other input bump electrodes IBMP and the SRAMs 2a to 2c (internal circuits) are disposed. |