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filingDate 2014-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101824785-B1
titleOfInvention Cleaning method for exposed copper substrate and cleaning system
abstract The water outlet of the subsystem having the ultraviolet oxidation device and the water inlet of each substrate processing device are connected via the main pipe. A hydrogen peroxide removal device (2) is provided between the ultraviolet oxidation device of the subsystem and the non-regenerative ion exchange device. The carbon dioxide supply device 4 is provided in the middle of the pipe 3 that branches from the water outlet of the subsystem and reaches the substrate processing apparatus 1. [ The hydrogen peroxide removal device 2 has a pattern of charging a platinum group metal catalyst. With this configuration, the concentration of hydrogen peroxide dissolved in the liquid is suppressed to 2 占 퐂 / liter or less based on the ultrapure water that has passed through the ultraviolet oxidation apparatus, and the specific resistance is adjusted in the range of 0.03 to 5.0 M? 占 ㎝ m by adding carbon dioxide And at least a substrate on which the copper or copper compound is exposed on the surface of the substrate processing apparatus 1 is cleaned by using the carbonic acid water.
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