| abstract |
The method includes forming a first dielectric layer over a conductive pad, forming a second dielectric layer over the first dielectric layer, and etching the second dielectric layer to form a first opening, The top surface of the layer is exposed to the first opening. The template layer is formed to fill the first opening. A second opening is then formed in the template layer and the first dielectric layer, and the top surface of the conductive pad is exposed in the second opening. The conductive filler is formed in the second opening. |