| titleOfInvention |
Copper foil, copper foil with carrier, copper-clad laminate, printed circuit board, circuit forming substrate for semiconductor package, semiconductor package, electronic device, resin substrate, circuit forming method, semiadditive method, and printed circuit board manufacturing method |
| abstract |
Provided is a copper foil for a semi-additive method, wherein adhesion of a plated film to an etched surface of a resin substrate to which a copper foil surface profile has been transferred is improved when the resin substrate is laminated and entirely etched. A copper foil comprising a copper foil bulk layer, a roughened treatment layer and a rust prevention treatment layer containing chromium in this order, wherein the copper foil is laminated on the resin base material from the side having the roughened treatment layer, (Wt.%) Of Cr, Zn, C, O, and Si when the surface of the copper foil was front-etched and the surface of the resin substrate after the front surface was analyzed by XPS was A and B (%) (= A / (A + B + C + D + E) x 100] of 0.1 to 10% when C, D, |