| abstract |
The present invention relates to a photocurable resin composition, and more particularly, to a photocurable resin composition, which can be applied to an imprint lithography mold to prevent an expensive plate stamp from being damaged due to excellent releasability to a plate stamp regardless of whether a release agent is treated on the surface of the plate stamp. In particular, it is possible to manufacture fine patterns necessary for manufacturing various electronic devices including semiconductors, displays and the like more quickly and stably, in particular, because of excellent chemical resistance and durability. |