| abstract |
Disclosed is an epoxy resin composition which has a low viscosity and can be cured at a low temperature in a short time and has excellent heat resistance, withstand voltage, electrical insulation, moisture resistance, mechanical strength and adhesiveness, (A) an epoxy resin, (B) 1,4-cyclohexanedimethanol diglycidyl ether, (C) an imidazole-based latent curing agent, and (B) 1,4-cyclohexanedimethanol di (meth) acrylate based on the total mass of the epoxy resin (A) and the 1,4-cyclohexanedimethanol diglycidyl ether (B) Wherein the content of the glycidyl ether is 0.5 to 80 mass%, the content of the (C) imidazole-based latent curing agent relative to the total mass of the total components of the epoxy resin composition is 5 to 25 mass% Phase for total mass (D) the content of the phenolic resin provides an epoxy resin composition, characterized in that 0.5 to 25% by mass. |