| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05547
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80986 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C10-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2010-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101809698-B1 |
| titleOfInvention |
Simplified copper-copper adhering method |
| abstract |
The present invention relates to a method for attaching a primary copper component to a secondary copper component. The method comprising forming on the surfaces of each of the first and second components an oxygen-rich crystalline copper layer to which the components are to be contacted, the total thickness of the two layers being less than 6 nm , Said step comprising: a) at least one step of polishing the surfaces to obtain hydrophilic surfaces having a roughness less than 1 nm RMS; b) at least one step of cleaning the surfaces to remove particles and most corrosion inhibitors from the polishing step; And c) contacting the two oxygen-rich copper crystalline layers. |
| priorityDate |
2009-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |