http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101809282-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-14 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-013 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
filingDate | 2012-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2017-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2017-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101809282-B1 |
titleOfInvention | Polishing monitoring method, polishing endpoint detecting method and polishing apparatus |
abstract | The present invention provides a method for polishing a conductive film on a substrate by pressing a substrate to be polished on a polishing surface on a rotating polishing table and monitoring the thickness of the conductive film by an eddy current sensor provided on the polishing table during polishing. In this method, the output signal of the eddy current sensor during polishing is acquired, the output adjustment amount of the eddy current sensor is calculated using the output signal when the substrate is not present above the eddy current sensor, Thereby correcting the output signal when the substrate exists above the eddy current sensor, and monitoring the thickness of the conductive film on the substrate based on the corrected output signal. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020016720-A1 |
priorityDate | 2011-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.