http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101807453-B1

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filingDate 2015-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101807453-B1
titleOfInvention Copper foil with carrier, manufacturing method for copper foil with carrier, copper clad laminate sheet and printed wiring board obtained using copper foil with carrier
abstract And it is an object of the present invention to provide a copper foil with a carrier capable of performing a stable peeling operation by reducing the fluctuation of the peeling strength at the interface between the carrier and the copper foil layer. In order to achieve this object, there is provided a copper foil with a carrier provided with a copper foil layer via a bonded interface layer on the surface of a carrier, wherein a carrier having a coefficient of variation CV of the peel strength of the carrier and the copper foil A copper foil or the like is used, and the fluctuation of the peeling strength in the width direction of the carrier is small, thereby realizing stable carrier peeling.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022124843-A1
priorityDate 2014-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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