http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101805096-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B28-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B29-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B15-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B11-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B19-068 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B29-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B15-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B28-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B19-06 |
| filingDate | 2010-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101805096-B1 |
| titleOfInvention | Methods and apparatus for making thin semiconductor bodies from molten material |
| abstract | A pressure differential is applied across the mold sheet and a semiconductor (e.g., silicon) wafer is formed thereon. Relaxing the pressure difference releases the wafer. The mold sheet may be colder than the melt. Heat is extracted almost entirely through the thickness of the forming wafer. The liquid and solid interfaces are substantially parallel to the mold sheet. The temperature of the solidifying solid is substantially uniform throughout its width, resulting in lower stress and dislocation densities and higher crystal quality. The mold sheet must flow through it. The melt is contacted with the entire area of the top of the melt; Transverse partial contact of the melt with the mold sheet, irrespective of the horizontal or vertical state; And the mold sheet may be introduced into the sheet by immersing the sheet in the melt. The particle size can be controlled by many means. |
| priorityDate | 2009-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.