Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28 |
filingDate |
2011-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2017-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-101803588-B1 |
titleOfInvention |
Novel phenol resin, curable resin composition, cured article thereof, and printed wiring board |
abstract |
A phenol resin having excellent heat resistance in a cured product and a low coefficient of thermal expansion, a curable resin composition using the phenolic resin as a curing agent for an epoxy resin, a cured product of the curable resin composition, and a printed wiring board excellent in heat resistance and low thermal expansion . A novel phenol resin having a resin structure in which a naphthol skeleton (n) and a naphthoquinone skeleton (q) obtained by oxidizing a polycondensate (a) of a naphthol compound and formaldehyde are bonded through a methylene bond is used as a curing agent for an epoxy resin do. |
priorityDate |
2010-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |