| abstract |
The present invention provides an electronic part having a conductor film without wet plating excellent in wire bonding property on the surface of a substrate. The electronic component 10 includes an inorganic substrate 20, a conductor film 30 formed on a surface of the substrate, and bonding wires 50 and 55 bonded to a part of the conductor film. (40, 45) are formed. Wherein at least a portion forming the wire bonding portion of the conductor film is made of a metal selected from the group consisting of an Ag-based metal consisting of an Ag or an Ag-based alloy and a metal selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg, And a metal oxide having any one of them as a constituent. The coating amount of the metal oxide is an amount corresponding to 0.02 to 0.1 part by mass based on 100 parts by mass of the Ag-based metal. |