abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board and a method of manufacturing the same, and more particularly, to a flexible printed circuit board and a method of manufacturing the same by simply forming a circuit pattern with a conductive paste on one surface of a substrate and firing the circuit pattern at 290 to 420 캜 The manufacturing process is facilitated, the productivity is improved, the circuit pattern is formed without the plating process, the problem of peeling of the circuit pattern generated in the plating process is solved, and the reliability of the product is improved. |