http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101783393-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48 |
| filingDate | 2010-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101783393-B1 |
| titleOfInvention | Gold plating bath for electrode and preparation method of electrode |
| abstract | A gold plating bath for electrode formation and an electrode forming method using the same are used for forming an electrode having a hardness and a shape suitable for electrode bonding in which an anisotropic conductive adhesive and a counter metal are formed. (a) a gold sulfurous acid salt or a gold sulfurous ammonium salt at a concentration of 1 - 20 g / L, (b) 0.1-100 mg / L as a metal concentration of a crystal adjusting agent composed of a Tl compound, a Pb compound or an As compound, (c) 5 to 150 g / L of sodium sulfite, (d) an inorganic acid salt, a carboxylic acid salt or a hydroxycarboxylic acid salt at a salt concentration of 1-60 g / L, (e) Electrodes are formed by plating using a gold plating bath for electrode formation containing a predetermined substituted aromatic compound in an amount of 1- 200 mmol / L. |
| priorityDate | 2009-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 133.