http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101775864-B1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
filingDate 2016-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101775864-B1
titleOfInvention Conductive paste and multilayer substrate using same
abstract The present invention provides a conductive paste having a viscosity suitable for hole filling of a substrate, a long pot life, and excellent conductivity and long-term reliability of a cured product, and a multi-layer substrate using the conductive paste. (A) 100 parts by mass of dimeric acid-modified epoxy resin (B) 200 to 1900 parts by mass of a low melting point metal powder having a melting point of 240 캜 or less, (C) 400 to 2,200 parts by mass of a high melting point metal powder containing a coated copper alloy powder having a melting point of 800 캜 or more, (D) 1.0 to 20.0 parts by mass of a curing agent containing a phosphorus-containing curing agent, and 5.0 to 100.0 parts by mass of a flux containing a polyvalent carboxylic acid (E).
priorityDate 2015-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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