| abstract |
The object of the present invention is to obtain a releasing film which is excellent in releasability, particularly, releasability from an epoxy resin adhesive, and which has heat resistance and does not need to be coated with a silicone releasing agent or the like. The present invention relates to a releasing film comprising polybutylene terephthalate (A), wherein the amount of the oligomer contained in the release film is 2500 ppm or less, and a method for producing a printed wiring board using the release film. |